SEMICONDUCTOR ASSEMBLING

We are offering below equipment which is used in the semiconductor back end process.
Die matrix expander, Wafer mounter, Dicing tape and UV curing system.
Please feel free to contact us for more information.

Dicing Tape

Dicing Tape

It is very important to choose the right tape for purpose of use.
We are offering appropriate tapes to the customers for their devices and process.

 

UV Curing System HUV-0608

Die Matrix Expander HS-1810

HUV-0608 is a low cost, high performance and easy to operate manual UV curing system.

 

Wafer Mounter HS-7800

Wafer Mounter HS-7800

~upto 8inch Dicing Frame

 



Wafer Mounter HS-7600

Wafer Mounter HS-7600

~upto 6inch Dicing Frame

 



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